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Intel 6700 Core2 Duo 2.66
"Descrizione"
by CPU1 (1876 pt)
2026-Feb-03 16:08

Intel Core 2 Duo E6700 

The Core 2 Duo E6700 (name: E6700) is a dual-core CPU by Intel designed for desktop systems, aiming to balance strong single-thread performance, good energy efficiency, and compatibility with Front Side Bus platforms. The processor runs at 2.66 GHZ, integrates 4 MB of L2 cache, and uses a 1066 MHZ FSB, with 64-bit instruction support.

From a design standpoint, the combination of clock speed, large L2 cache, and a 1066 MHZ bus is intended to reduce perceived latency in common applications and sustain multitasking workloads, while keeping a manageable thermal profile (TDP 65 W) for standard desktop systems.


Name and positioning: E6700

The E6700 designation identifies a specific model in the Core 2 Duo family, typically targeted at:

  • general-purpose desktops and entry-level workstations

  • workloads where responsiveness and stable performance matter

  • FSB-based chipsets/memory configurations, where cache and bus bandwidth strongly influence real behavior


Frequency: 2.66 GHZ and practical behavior

The 2.66 GHZ frequency defines the baseline performance profile. In practice:

  • on light and interactive workloads, responsiveness is strongly tied to frequency and cache latency

  • on moderate multi-thread workloads, the dual-core design helps distribute processes and keep multitasking fluid

  • overall results also depend on the chipset, RAM, and power settings (VID)


L2 cache: 4 MB and performance impact

The 4 MB L2 cache reduces dependence on system RAM for medium working sets and repetitive access patterns. In practice:

  • it improves performance consistency in real applications (browsing, office, productivity tools)

  • it reduces penalties from main-memory accesses when datasets are not too large

  • it also helps on branch-heavy code, where instruction/data reuse is frequent


FSB: 1066 MHZ and platform dependency

The 1066 MHZ Front Side Bus is the channel between the CPU and the chipset/memory. Operationally:

  • it determines how much bandwidth is available to RAM and I/O through the northbridge

  • it can become a constraint if the platform is unbalanced (slow RAM, limited chipset)

  • a large L2 cache mitigates some pressure on the FSB, but does not eliminate it


Instruction set: 64-bit

64-bit support enables:

  • running 64-bit operating systems and applications

  • addressing a larger memory space (useful with more RAM and modern workloads)

  • in practice, longer platform longevity versus 32-bit-only solutions


Technology and electrical parameters: 65 NM, VID, 65 W TDP

Process: 65 NM
The 65 NM process aligns with a generation targeting strong clocks with relatively controlled desktop power.

VID voltage range: 0.8500 V – 1.5 V
The VID range indicates the nominal voltage window managed by the platform for this model. In practice:

  • it impacts load power and temperatures

  • it influences stability margins and power-management behavior

TDP: 65 W
A 65 W TDP places the CPU in a class compatible with standard desktop cooling solutions, with a balanced performance/thermal profile.


Package and die: size and density

Package size: 37.5 mm × 37.5 mm
A package of this size is typical for socketed desktop processors of the era, with implications for mechanical retention and thermal contact to the heatsink.

Processing die size: 143 mm3
The provided die value (143 mm3) represents the physical size of the processing silicon. In practice, size and density influence localized heat flux and thermal distribution.

Transistors: 291 million
A count of 291 million transistors indicates an integration level appropriate for two cores and a substantial shared L2 cache.


Sketch of the most important connections

1066 MHZ FSB + chipset (memory and I/O) ┌──────────────────────────────────────────────────────────┐ │ northbridge / chipset + RAM + I/O controllers │ │ RAM, storage, peripherals, system buses │ └───────────────────────────────┬──────────────────────────┘ │ ▼ ┌─────────────────────────────┐ │ Intel Core 2 Duo E6700 │ │ 2.66 GHZ, 64-bit │ │ 4 MB L2, 65 W TDP │ └─────────────┬───────────────┘ │ ├────────► RAM (via chipset over FSB) └────────► I/O (storage/network/graphics via platform)

Table 1 – Identification data and specifications

CharacteristicIndicative value
NameE6700
FamilyCore 2 Duo
Frequency2.66 GHZ
L2 cache4 MB
FSB speed1066 MHZ
Instruction set64-bit
Process65 NM
VID voltage range0.8500 V – 1.5 V
TDP65 W
Package size37.5 mm × 37.5 mm
Processing die size143 mm3
Transistors291 million


Table 2 – Operational and design considerations

AspectPractical meaning
2.66 GHZStrong responsiveness and single-thread performance for desktop use
Dual-coreBetter multitasking and handling of moderate parallel workloads
4 MB L2Reduces RAM accesses, improves consistency on medium working sets
1066 MHZ FSBBandwidth/latency depend on chipset; can bottleneck memory-bound workloads
64-bit64-bit OS/app support and longer platform lifespan
65 NMGeneration-typical performance/power trade-off
VID 0.8500–1.5 VImpacts power/thermals; tied to motherboard power management
65 W TDPStandard desktop cooling, manageable thermal profile
37.5×37.5 mm packageSocketed integration and heatsink thermal interface
291 million transistorsIntegration appropriate for two cores and a large shared L2 cache

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