Highlights

Hello, Guest!

‹

View

›

I.C. - Package

Featured products

Micro-BGA2 Rating 9

Micro-BGA2 is an advanced evolution of the Ball Grid Array package, specifically developed to meet the growing demands for miniaturization and ultra-high-density integration in modern electronic devices. This packaging solution...

2016-Feb-09

MMC-2 Rating 8

Description not yet available.

2016-Feb-09

DIP 40 pin

Description not yet available.

2016-Feb-09

DIP 16 pin

Description not yet available.

2016-Feb-09

DIP 14 pin

Description not yet available.

2016-Feb-09

DIP 8 pin

Description not yet available.

2016-Feb-09

Latest inserted Tiiip

Show my Tiiips

Description 0 pts

about PGA 431

PGA 431 refers to a PGA (pin grid array) package or socket form factor with a to ...

by FRanier 2026-Feb-13 06:47

Description 0 pts

about PGA 431

Con PGA 431 si indica un form factor di package o zoccolo di tipo PGA (pin grid ...

by FRanier 2026-Feb-13 06:46

Description 0 pts

about Micro-BGA2

Micro-BGA2: Versione per computer portatiliMicro-BGA2 rappresenta un’evolu ...

by CPU1 2026-Jan-15 10:04

Description 0 pts

about Micro-BGA2

Micro-BGA2 is an advanced evolution of the Ball Grid Array package, specifically ...

by Al222 2026-Jan-15 10:03

Description 6 pts

about MMC-2

La CPU è integrata in una schedina elettronica. Veniva utilizzato solita ...

by CPU1 2020-Jan-11 13:54

Description 7 pts

about PGA 168 pin

Connettore a contatti dorati che alloggiava la CPU 486. Anno 1990. ...

by CPU1 2019-Dec-28 17:34

About Us Terms of use FAQ Invite a Friend Contact Us Language (en)

Select Language

English

Italiano