Micro-BGA2 is an advanced evolution of the Ball Grid Array package, specifically developed to meet the growing demands for miniaturization and ultra-high-density integration in modern electronic devices. This packaging solution is primarily used in high-performance components such as microprocessors, ASICs, SoCs, and advanced memory devices, where PCB real estate is extremely constrained. The defining feature of Micro-BGA2 lies in the use of very small solder balls with an extremely fine pitch, often equal to or below 0.4 mm, allowing a high number of electrical interconnections within a minimal footprint.

The “2” designation refers to a second-generation design that incorporates improvements in both substrate materials—typically advanced organic or reinforced resin-based substrates—and overall electrical and thermal performance. From a functional standpoint, Micro-BGA2 reduces parasitic inductance and significantly enhances signal integrity, making it suitable for high-frequency applications. Assembly requires high-precision SMT processes, strict control of the reflow profile, and X-ray inspection systems, as direct visual access to solder joints is not possible. Due to its structural complexity, rework operations are challenging and often not cost-effective, positioning Micro-BGA2 as a packaging solution mainly adopted in high-volume, high-technology electronic products.